Frank Liang

EY World Entrepreneur Of The Year™ 2026 finalist, Taiwan
CEO and President, C SUN

Frank Liang is redefining advanced packaging equipment solutions across the global semiconductor industry.

Photographic portrait of Frank Liang

Frank Liang never expected to chart a career in one of the world’s most complex technical industries. Coming from a non-STEM background, his perspective shifted in 2016 after a serious illness prompted a reassessment of what it meant to be a second-generation leader. He returned to the business with a renewed sense of responsibility — not only to his family’s legacy, but to employees, customers, partners, shareholders, society and the environment. His purpose became clear: build an enterprise platform designed to enable others to succeed long after any one individual.

Today, Frank is General Manager and CEO of C SUN, a company established in 1966 and known for its expertise in light and thermal applications, including lamination, bonding, debonding, thermal curing and preplating surface treatments. He also serves as CEO of GMM and GPM. In 2020, the three organizations formed the G2C+ Alliance, an integrated platform that preserves autonomy within each company while delivering cohesive solutions for advanced semiconductor and packaging customers.

Under Frank’s leadership, the alliance has strengthened technical depth, advanced Environmental, Social, and Governance (ESG) priorities and built resilient teams. C SUN is central to a collaborative ecosystem that supports global semiconductor leaders and creates long-term economic and social value in the emerging artificial intelligence (AI)-driven era. It has earned repeated recognition from global customers, reinforcing its role as a trusted partner in next-generation process technologies from 3D stacking to heterogeneous integration.

Throughout history, technological breakthroughs have reshaped the world, and today AI is transforming the semiconductor industry – especially advanced packaging – where demands for complexity, speed and precision are all rising at the same time.